一(yi)般(ban)底部(bu)(bu)(bu)填(tian)充(chong)(chong)(chong)膠(jiao)(jiao)(jiao)的(de)(de)(de)應用(yong)(yong)原理是(shi)利用(yong)(yong)毛細(xi)作用(yong)(yong)使得膠(jiao)(jiao)(jiao)水(shui)迅速(su)流(liu)入BGA芯(xin)片(pian)底部(bu)(bu)(bu)芯(xin)片(pian)底部(bu)(bu)(bu)，其毛細(xi)流(liu)動的(de)(de)(de)較小空間(jian)是(shi)10um。加(jia)熱之(zhi)(zhi)后(hou)可(ke)以(yi)固(gu)化(hua)，一(yi)般(ban)固(gu)化(hua)溫(wen)(wen)度(du)在(zai)80℃-150℃。底部(bu)(bu)(bu)填(tian)充(chong)(chong)(chong)膠(jiao)(jiao)(jiao)簡單來說就(jiu)是(shi)底部(bu)(bu)(bu)填(tian)充(chong)(chong)(chong)之(zhi)(zhi)義，常規定(ding)義是(shi)一(yi)種用(yong)(yong)化(hua)學膠(jiao)(jiao)(jiao)水(shui)（主要(yao)成份是(shi)環(huan)氧樹脂）對BGA 封(feng)裝(zhuang)(zhuang)模式(shi)的(de)(de)(de)芯(xin)片(pian)進行底部(bu)(bu)(bu)填(tian)充(chong)(chong)(chong)，利用(yong)(yong)加(jia)熱的(de)(de)(de)固(gu)化(hua)形式(shi)，將BGA 底部(bu)(bu)(bu)空隙大面積 (一(yi)般(ban)覆蓋(gai)一(yi)般(ban)覆蓋(gai)80%以(yi)上)填(tian)滿(man)，從而(er)達(da)到加(jia)固(gu)的(de)(de)(de)目的(de)(de)(de)，增強BGA 封(feng)裝(zhuang)(zhuang)模式(shi)的(de)(de)(de)芯(xin)片(pian)和PCBA 之(zhi)(zhi)間(jian)的(de)(de)(de)抗(kang)跌(die)落性能。一(yi)般(ban)底部(bu)(bu)(bu)填(tian)充(chong)(chong)(chong)膠(jiao)(jiao)(jiao)還有一(yi)些非常規用(yong)(yong)法，是(shi)利用(yong)(yong)一(yi)些瞬干(gan)膠(jiao)(jiao)(jiao)或(huo)常溫(wen)(wen)固(gu)化(hua)形式(shi)膠(jiao)(jiao)(jiao)水(shui)在(zai)BGA 封(feng)裝(zhuang)(zhuang)模式(shi)芯(xin)片(pian)的(de)(de)(de)四周或(huo)者部(bu)(bu)(bu)分(fen)(fen)角落部(bu)(bu)(bu)分(fen)(fen)填(tian)滿(man)，從而(er)達(da)到加(jia)固(gu)目的(de)(de)(de)。底部(bu)(bu)(bu)填(tian)充(chong)(chong)(chong)膠(jiao)(jiao)(jiao)會直接影響倒裝(zhuang)(zhuang)芯(xin)片(pian)的(de)(de)(de)可(ke)靠性。聊城圍堰填(tian)充(chong)(chong)(chong)膠(jiao)(jiao)(jiao)廠家

底(di)(di)部(bu)(bu)(bu)填(tian)(tian)充(chong)膠(jiao)(jiao)(jiao)起(qi)到密封(feng)保(bao)護加固(gu)作(zuo)(zuo)用(yong)的(de)(de)前提是(shi)膠(jiao)(jiao)(jiao)水已經(jing)固(gu)化(hua)(hua)，而焊(han)點周圍有錫膏(gao)中(zhong)的(de)(de)助焊(han)劑殘留，如果底(di)(di)部(bu)(bu)(bu)填(tian)(tian)充(chong)膠(jiao)(jiao)(jiao)與(yu)殘留的(de)(de)助焊(han)劑不兼容(rong)，導致底(di)(di)部(bu)(bu)(bu)填(tian)(tian)充(chong)膠(jiao)(jiao)(jiao)無法有效固(gu)化(hua)(hua)，那么底(di)(di)部(bu)(bu)(bu)填(tian)(tian)充(chong)膠(jiao)(jiao)(jiao)也就起(qi)不到相應的(de)(de)作(zuo)(zuo)用(yong)了，因(yin)此(ci)，底(di)(di)部(bu)(bu)(bu)填(tian)(tian)充(chong)膠(jiao)(jiao)(jiao)與(yu)錫膏(gao)是(shi)否兼容(rong)，是(shi)底(di)(di)部(bu)(bu)(bu)填(tian)(tian)充(chong)膠(jiao)(jiao)(jiao)選擇與(yu)評估時需要重(zhong)點關注的(de)(de)項目。將錫膏(gao)與(yu)底(di)(di)部(bu)(bu)(bu)填(tian)(tian)充(chong)膠(jiao)(jiao)(jiao)按1:3的(de)(de)比(bi)例混合，通過(guo)DSC（差(cha)示掃描(miao)量熱(re)儀）測試混合錫膏(gao)后的(de)(de)膠(jiao)(jiao)(jiao)水與(yu)未(wei)混合錫膏(gao)膠(jiao)(jiao)(jiao)水熱(re)轉變(bian)溫度變(bian)化(hua)(hua)的(de)(de)差(cha)異(yi)，如沒(mei)有明(ming)顯差(cha)異(yi)則(ze)說(shuo)明(ming)底(di)(di)部(bu)(bu)(bu)填(tian)(tian)充(chong)膠(jiao)(jiao)(jiao)與(yu)錫膏(gao)兼容(rong)。底(di)(di)部(bu)(bu)(bu)填(tian)(tian)充(chong)膠(jiao)(jiao)(jiao)在安(an)防器(qi)械、汽車電子、軍(jun)業(ye)電子等行業(ye)普(pu)遍使用(yong)。重(zhong)慶(qing)二次回流(liu)底(di)(di)部(bu)(bu)(bu)填(tian)(tian)充(chong)膠(jiao)(jiao)(jiao)哪家(jia)好底(di)(di)部(bu)(bu)(bu)填(tian)(tian)充(chong)膠(jiao)(jiao)(jiao)因(yin)毛細管虹(hong)吸作(zuo)(zuo)用(yong)按箭(jian)頭方向自動填(tian)(tian)充(chong)。

底(di)(di)(di)部(bu)填(tian)(tian)充(chong)膠(jiao)加(jia)(jia)熱(re)之后可以固(gu)(gu)化，一般(ban)(ban)(ban)固(gu)(gu)化溫(wen)度在(zai)80℃-150℃。底(di)(di)(di)部(bu)填(tian)(tian)充(chong)膠(jiao)簡單(dan)來說就(jiu)是(shi)底(di)(di)(di)部(bu)填(tian)(tian)充(chong)之義(yi)，常(chang)規定義(yi)是(shi)一種用(yong)化學膠(jiao)水（主要成份是(shi)環(huan)氧樹脂）對BGA封裝模式的(de)芯(xin)片(pian)進行底(di)(di)(di)部(bu)填(tian)(tian)充(chong)，利用(yong)加(jia)(jia)熱(re)的(de)固(gu)(gu)化形式，將BGA底(di)(di)(di)部(bu)空隙大面積(ji)(一般(ban)(ban)(ban)覆(fu)蓋一般(ban)(ban)(ban)覆(fu)蓋80%以上)填(tian)(tian)滿，從而達到加(jia)(jia)固(gu)(gu)的(de)目的(de)，增強BGA封裝模式的(de)芯(xin)片(pian)和PCBA之間(jian)的(de)抗(kang)跌(die)落(luo)性(xing)能。底(di)(di)(di)部(bu)填(tian)(tian)充(chong)膠(jiao)還(huan)(huan)有一些(xie)非常(chang)規用(yong)法，是(shi)利用(yong)一些(xie)瞬干膠(jiao)或常(chang)溫(wen)固(gu)(gu)化形式膠(jiao)水在(zai)BGA封裝模式芯(xin)片(pian)的(de)四周(zhou)或者部(bu)分角落(luo)部(bu)分填(tian)(tian)滿，從而達到加(jia)(jia)固(gu)(gu)目的(de)。其應(ying)用(yong)原(yuan)理是(shi)利用(yong)毛細(xi)作(zuo)用(yong)使得膠(jiao)水迅(xun)速流入BGA芯(xin)片(pian)底(di)(di)(di)部(bu)芯(xin)片(pian)底(di)(di)(di)部(bu)，其毛細(xi)流動(dong)的(de)較小空間(jian)是(shi)10um。底(di)(di)(di)部(bu)填(tian)(tian)充(chong)膠(jiao)除(chu)了(le)有著出色的(de)抗(kang)跌(die)落(luo)性(xing)能外，還(huan)(huan)具有良好的(de)耐(nai)沖擊、耐(nai)熱(re)、絕緣、抗(kang)跌(die)落(luo)、抗(kang)沖擊等性(xing)能。

什么是底(di)部(bu)(bu)填(tian)(tian)充(chong)(chong)(chong)膠(jiao)(jiao)？底(di)部(bu)(bu)填(tian)(tian)充(chong)(chong)(chong)膠(jiao)(jiao)簡單來說就是底(di)部(bu)(bu)填(tian)(tian)充(chong)(chong)(chong)用(yong)(yong)的(de)(de)(de)(de)膠(jiao)(jiao)水，主要是以(yi)主要成份為(wei)(wei)環氧樹(shu)脂(zhi)的(de)(de)(de)(de)膠(jiao)(jiao)水對BGA封(feng)裝(zhuang)模(mo)式的(de)(de)(de)(de)芯(xin)片(pian)(pian)進行(xing)底(di)部(bu)(bu)填(tian)(tian)充(chong)(chong)(chong)，利用(yong)(yong)加熱的(de)(de)(de)(de)固(gu)化(hua)形(xing)式，將BGA芯(xin)片(pian)(pian)底(di)部(bu)(bu)空隙大面積 (一般覆蓋80%以(yi)上)填(tian)(tian)滿，從(cong)而達到加固(gu)芯(xin)片(pian)(pian)的(de)(de)(de)(de)目的(de)(de)(de)(de)，進而增強芯(xin)片(pian)(pian)和PCBA 之間的(de)(de)(de)(de)抗跌(die)落(luo)性(xing)能。那么為(wei)(wei)什么使用(yong)(yong)底(di)部(bu)(bu)填(tian)(tian)充(chong)(chong)(chong)膠(jiao)(jiao)呢？底(di)部(bu)(bu)填(tian)(tian)充(chong)(chong)(chong)膠(jiao)(jiao)對SMT（電(dian)子電(dian)路表面組(zu)裝(zhuang)技術）元件（如(ru)：BGA、CSA芯(xin)片(pian)(pian)等(deng)）裝(zhuang)配(pei)的(de)(de)(de)(de)長(chang)期可(ke)靠性(xing)有了一定的(de)(de)(de)(de)保障性(xing)；還能很(hen)好(hao)的(de)(de)(de)(de)減少焊接點(dian)(dian)(dian)的(de)(de)(de)(de)應(ying)力，將應(ying)力均勻分(fen)散在芯(xin)片(pian)(pian)的(de)(de)(de)(de)界面上，在芯(xin)片(pian)(pian)錫球陣列中，底(di)部(bu)(bu)填(tian)(tian)充(chong)(chong)(chong)膠(jiao)(jiao)能有效的(de)(de)(de)(de)減少焊錫點(dian)(dian)(dian)本身(shen)（即(ji)結構內的(de)(de)(de)(de)薄弱點(dian)(dian)(dian)）因為(wei)(wei)熱膨脹系(xi)數不同而發生的(de)(de)(de)(de)應(ying)力沖擊。此(ci)外，底(di)部(bu)(bu)填(tian)(tian)充(chong)(chong)(chong)膠(jiao)(jiao)膠(jiao)(jiao)水還能防止潮濕和其它形(xing)式的(de)(de)(de)(de)污染。底(di)部(bu)(bu)填(tian)(tian)充(chong)(chong)(chong)膠(jiao)(jiao)能很(hen)好(hao)地控(kong)制樹(shu)脂(zhi)溢出，既(ji)可(ke)應(ying)用(yong)(yong)于(yu)傳統的(de)(de)(de)(de)針頭點(dian)(dian)(dian)膠(jiao)(jiao)，也可(ke)應(ying)用(yong)(yong)于(yu)噴膠(jiao)(jiao)工(gong)藝(yi)，工(gong)藝(yi)適(shi)應(ying)性(xing)優異(yi)。

PCB板(ban)芯片底(di)部(bu)填(tian)(tian)充(chong)點(dian)(dian)膠(jiao)加(jia)工所用(yong)的底(di)部(bu)填(tian)(tian)充(chong)膠(jiao)是一種低(di)(di)黏(nian)度、可低(di)(di)溫固(gu)化的，有毛細管流(liu)(liu)動效(xiao)果的一種底(di)部(bu)下填(tian)(tian)料(liao)，流(liu)(liu)動速度快，使(shi)用(yong)壽命長、翻(fan)修(xiu)性(xing)(xing)能(neng)佳。應用(yong)在MP3、USB、手(shou)機(ji)(ji)、籃牙耳(er)機(ji)(ji)、耳(er)機(ji)(ji)、音(yin)響(xiang)、智(zhi)能(neng)手(shou)環、智(zhi)能(neng)手(shou)表、智(zhi)能(neng)穿戴等電子產(chan)品的PCB線路板(ban)組裝與封(feng)裝。PCB板(ban)芯片底(di)部(bu)填(tian)(tian)充(chong)點(dian)(dian)膠(jiao)加(jia)工優(you)點(dian)(dian)如(ru)下：PCB板(ban)芯片底(di)部(bu)填(tian)(tian)充(chong)點(dian)(dian)膠(jiao)加(jia)工高可靠性(xing)(xing)，耐(nai)熱(re)性(xing)(xing)好和抗機(ji)(ji)械沖擊能(neng)力強；黏(nian)度低(di)(di)，流(liu)(liu)動快，PCB不需預熱(re)；PCB板(ban)芯片底(di)部(bu)填(tian)(tian)充(chong)點(dian)(dian)膠(jiao)加(jia)工完成后固(gu)化前(qian)后顏色不一樣(yang)，方便(bian)檢驗；PCB板(ban)芯片底(di)部(bu)填(tian)(tian)充(chong)點(dian)(dian)膠(jiao)加(jia)工固(gu)化時間短，可大批(pi)量(liang)生(sheng)產(chan)；翻(fan)修(xiu)性(xing)(xing)好，減少不良率。底(di)部(bu)填(tian)(tian)充(chong)膠(jiao)應用(yong)效(xiao)率性(xing)(xing)包括操作性(xing)(xing)。義烏焊(han)點(dian)(dian)保護膠(jiao)廠家

底部填(tian)充膠利用加熱的(de)固(gu)化形(xing)式(shi)，將BGA 底部空隙(xi)大面積(ji)填(tian)滿(man)，從(cong)而達到加固(gu)的(de)目的(de)。聊城圍堰(yan)填(tian)充膠廠(chang)家

底(di)(di)(di)部(bu)(bu)(bu)填(tian)充(chong)膠受(shou)熱時(shi)能(neng)(neng)(neng)快速固化(hua)、粘(zhan)度較(jiao)低，并(bing)且(qie)較(jiao)高的流(liu)動性使(shi)得其能(neng)(neng)(neng)更(geng)好的進行底(di)(di)(di)部(bu)(bu)(bu)填(tian)充(chong)，它能(neng)(neng)(neng)形成一(yi)致和無缺陷(xian)的底(di)(di)(di)部(bu)(bu)(bu)填(tian)充(chong)層，能(neng)(neng)(neng)有(you)(you)(you)效降(jiang)低由于芯(xin)片(pian)與基(ji)板之(zhi)間的總體溫度膨(peng)脹特性不匹配或外(wai)力造成的沖擊，我們(men)日常(chang)使(shi)用(yong)的手(shou)機(ji)，從(cong)高地方落(luo)下，開機(ji)仍(reng)然(ran)可(ke)以正常(chang)運作(zuo)，對(dui)(dui)手(shou)機(ji)性能(neng)(neng)(neng)基(ji)本沒有(you)(you)(you)影響，只是外(wai)殼刮花了(le)(le)點。很(hen)神奇對(dui)(dui)不對(dui)(dui)？這就(jiu)是因(yin)為(wei)應用(yong)了(le)(le)BGA底(di)(di)(di)部(bu)(bu)(bu)填(tian)充(chong)膠，將BGA和CSP進行填(tian)充(chong)，讓其更(geng)牢固的粘(zhan)接在(zai)PBC板上。戶(hu)外(wai)大型LED顯(xian)示(shi)屏(ping)，由大面積的LED燈珠排列組成，單個LED燈珠之(zhi)間存在(zai)縫隙(xi)，依然(ran)不受(shou)外(wai)界(jie)的風吹雨淋，均(jun)可(ke)以正常(chang)工作(zuo)，原因(yin)就(jiu)是在(zai)LED燈面使(shi)用(yong)了(le)(le)底(di)(di)(di)部(bu)(bu)(bu)填(tian)充(chong)膠，把所有(you)(you)(you)的縫隙(xi)填(tian)充(chong)保護(hu)，所有(you)(you)(you)才有(you)(you)(you)我們(men)現在(zai)時(shi)刻(ke)欣賞到的LED大屏(ping)幕。聊城圍(wei)堰填(tian)充(chong)膠廠家(jia)